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| Messen & andere Events
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| MDM EAST 2008 |
VISIT US AT BOOTH #865
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| SMT/HYBRID/PACKAGING 2008 |
June 3-5, PVA TePla Booth, Hall 9, Booth Number 309
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| Interconex 2008 in Paris, France |
June 24-25, Booth 20
Please Join Our New Representative
MB Electronique
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| Semicon West 2008 |
VISIT US AT BOOTH # 8611 in hall W 2
JULY 15 -17, 2008
CLICK HERE FOR A FREE EXHBITS PASS
Use Priority Code: TEPLAAG
PVA TePla AG specializes in unique Microwave Plasma Processing systems for silicon, compound semiconductors, MEMS, FPD, and solar cell manufacturing. Front-End applications include photo resist ashing and descum, as well as polymer, SU8 and sacrificial layer removal for MEMS. Pre-Assembly solutions include stress relief, Chip Side Healing (CSH) and passivation for ultra-thin wafer technologies down to 25µm thickness. Back-End applications include pre-wire bonding/pre-encapsulation cleaning and surface activation for Flip Chip, stacked dies, MCM and advanced Cu lead frames. Our metrology tools offer unique stress/defect analysis (SIRD) and ion implantation monitoring (TWIN) for quality inspection on 12” wafers in high volume manufacturing. |
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| BIOMEDevice 2008 |
AT SAN JOSE
September 10-11, 2008
BOOTH #742 |
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