“Perfect Die” - Technology
PVA TePla has extended the proven ASYNTIS Wafer Level Stress Relief Process for Ultra Thin Wafers (UTW) focussing also on Chip Level Surface Healing. The UTW Market is now requesting many new surface treating methods in order to achieve the “Perfect Die” for 3D stacking. With our unique and remarkable Remote Cold Dry Etch Technology new market segments are addressed and are becoming essential in order to produce thin and flexible chips for 3D-Application, SOI and Low-K material.
6/26/07
2007 VLSI Research Inc Overall 10 BEST Awards for Chip Making Equipment
PVA TePla AG, Asslar, the established manufacturer of crystal growing and plasma systems for the semiconductor industry, has won second place in an overall category in the 10 BEST customer satisfaction survey conducted by VLSI Research Inc, Santa Clara, Ca. USA.
6/19/07
IVD Technology Magazine PROCESSING TECHNOLOGIES
Article: Gas plasma treatment of IVD device platforms
Surface modification of IVD platforms by means of a dry process controls the adhesion properties of cells and biomolecules.
