Ion 40 Plasma System | PVATePla America, Inc.
   
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Ion 40 Gas Plasma System

Technical Data

Process Chamber
Material                        Aluminum
Volume                         38 liters
Inner Dimensions         229 x 330 x 508 mm 9” x 13” x 20”

Available Electrodes

  • Primary Plasma
  • Vertical Electrode
  • Side wall Electrode
  • Removable 3 & 5 shelf 289 mm x 234 mm 11.38” x 13.15” tray
  • Temperature controlled 3 shelf
  • Low particulate electrode
  •  Secondary Plasma electrode

Process Gas
Mass Flow Control        up to 8 gasses
Process Pressure           Approx. 120-2000 mTorr            (pump and gas flow dependent)
Evacuation Time           ~1 minute (pump dependent)
Venting                        Adjustable
RF Generator                Air cooled
100 KHz, 300 Watts (Standard)

Power Requirements
Electricity                     110 VAC or 220 VAC single phase, 2.3 KW, 50/60 Hz
Process Gas                  Input pressure 1-2 bar  30 PSI
Purge Gas                     Input pressure 1-2 bar  30 PSI
Compressed Air           Input pressure 5 bar 75 PSI
Dimensions W/H/D       775 x 723 x 781 mm 30.5” x 28.5” x 30.75”
Weight                        156.36 kg / 344 lbs.
                                               
Options

  • 1% pressure monitor
  • Pressure controller
  • Light tower
  • Barcode reader
  • Alternate gas selector
  • Spectrographic endpoint detection
  • 300 and 600 watt 13.56 generator
  • Stainless steel MFC
  • Printer
  • Recirculating liquid chiller
  • Table
  • Monomer processing kit
  • Vacuum pumps (rotary vane, dry and scroll)
  • Vapor phase MFC

Safety Certification Standards
Independently laboratory tested:

  • CE certified 
  •  EN 61010 
  •  EN 61326

The IoN 40 is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale.  As a result, plasma is replacing older types of treatments that are no longer practical or economical.

The IoN 40 is designed to meet the evolving demands of our customers, emphasizing versatility and control for their surface treatment needs. Its advanced features provide state of the art process control, fail-safe system alarms and data capturing software. This enables the system to meet stringent quality control programs in the Life Science industries. The IoN 40 uses radio frequency (RF) generated plasma in a compact, fully integrated package. Its bench top design allows for easy installation in laboratory or production environments.

Features include:

  • Fully configurable chamber that can accommodate
    various electrode configurations for medium sized
    complex 3-dimensional parts or high volume small
    part processing
  • Industrial computer with a Windows® based system
  • Graphical User Interface (GUI) software complies with CFR Title 24 Part 11 and Semi E95-1101
  • User access control for separate process
  • development, operator and maintenance programming and control
  • Configurable process tolerance controls allowing precise lot-to-lot repeatability
  • Remote statistical process control monitoring via Ethernet
  • Onboard diagnostic features and alarm logging
  • Recipe editor offers fast and versatile step control functionality
  • Liquid Crystal Display (LCD) touch panel and keyboard

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