Improve wiringbonding by bond pad cleaning.

The Atmospheric PlasmaPen® has recently been applied to bond pad cleaning with incredible success. In production, the PlasmaPen® is easily integrated either in-line or on-board wirebonders for in-situ cleaning of bond pads. Of course this type of processing does not require substrate staging, which means bond pads are pristine clean when bonded and production flow is much faster.

The PlasmaPen® produces no voltage or current in its plume and therefore does not damage electronic devices. Despite its low temperature the energy created by the PlasmaPen® cleans much more efficiently than Corona discharge-like technologies. The low operating costs (compressed air is the reactant gas) and low capitol cost of the system make the PlasmaPen® the most exciting recent innovation for bond pad cleaning applications.

Systeme:
	PlasmaPen®

Warum RF-Plasma ?