Teflon® activation

Teflon®, with its very low dielectric constant, is an excellent material to ensure fast signal propagation and superb isolation properties. The defining properties of Teflon®, however, also mean that it is difficult to plate. Prior to electroless copper plating the Teflon® surface must first be plasma activated to increase its surface energy so that the copper will adhere. PVA TePla America has developed a proprietary gas plasma recipe that provides excellent wettability of Teflon®, and with an activation lifetime much longer than standard plasma processes that use N2 and H2 reactant gases.

Systeme:

4031 / 4061 / 4081

The plasma systems series 4031, 4061 and 4081 are high-capacity production tools for use in printed circuit board manufacturing.

Warum RF-Plasma ?