PS 400	PS 660

The Microwave Plasma Systems 400 and 660 are the most versatile plasma cleaners in the world of chip packaging. Our unique microwave plasma process technology serves a broad spectrum of applications including plasma cleaning before wire bonding, mold and FlipChip underfill as well as the cleaning of whole wafers (up to 12"). Featuring electrode-free energy feeding and plasma generation, the 400 and 660 systems deliver unsurpassed flexibility. This electrode-free power coupling is key to the treatment of substrates in closed, non-slotted magazines in the downstream process.

Slotted magazines are processed perfectly on a rotating platform.

In addition, the ECR mode is an extra function of these plasma systems.

Our H2 process capability upgrade (using pure H2) provides unsurpassed cleaning performance prior to wire bonding, e.g. removing fluorine (F2) residues, sulphur (S) impurities or oxide layers, (H2 safety certificate available) and is ideal for oxygen sensitive substrates, such as Cu, N, and Ag .

The systems are noted for their highly user-friendly interface and easily mastered operating platform. The Plasma Systems 400 and 660 are available with a hinged or sliding-type door design.

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