Plasma System 4008 | PVATePla America, Inc.
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Direct Microwave Plasma System 4008

Technical Specifications:

Plasma Chamber:
 Aluminum
 W x H x D = 410 x 140 x 410 mm

Plasma Generation:
 MW Frequency 2.45 GHz
 max. 1600 Watt
 variable power

System Dimension:
 W x H x D = approx. 850 x 2.000 x 1300 mm
 Weight: 550 kg
 Options:
  Additional gas channels
  Vacuum pump

Related Applications:

  • Photoresist Ashing
  • SU8 Ashing
  •  

    PS 4008

    The PS 4008 is designed for stripping extremely hardened or resistant materials, such as SU-8 epoxy resist. The direct microwave plasma design results from PVA TePla AG's combined experience in resist stripping and flat panel display processing. The direct microwave plasma allows high strip rates while maintaining low substrate temperature.

    The PS 4008 features a large area direct microwave source in combination with a temperature controlled substrate stage and can be made fully compatible with fluorine chemistry. Maximum substrate size is 300x300mm.

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