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| Direct Microwave Plasma System 4008 |
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Technical Specifications: Plasma Chamber:
Plasma Generation:
System Dimension:
Related Applications: |
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The PS 4008 is designed for stripping extremely hardened or resistant materials, such as SU-8 epoxy resist. The direct microwave plasma design results from PVA TePla AG's combined experience in resist stripping and flat panel display processing. The direct microwave plasma allows high strip rates while maintaining low substrate temperature. The PS 4008 features a large area direct microwave source in combination with a temperature controlled substrate stage and can be made fully compatible with fluorine chemistry. Maximum substrate size is 300x300mm. To Request a Brochure/Literature/Product CD, Click Here
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