Most compact version of the GIGAfab model family, targeting SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology.

Featuring unique planar source geometry and temperature-controlled substrate plate for large area processing in R&D and production. Suitable for uniform processing of single large or multiple substrates for Descum, Ashing and Surface Conditioning.

Microwave power: 2000 Watt max.
Cooled substrate plate: 310 x 310 mm
Manual substrate loading

Certified Hydrogen gas option available.

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