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| Microwave Plasma System 300 Series |
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Technical Specifications: Plasma Chamber:
Plasma Generation:
Related Applications: |
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Microwave Plasma System Series PS 300 The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum. Depending on the size of substrate (2”-8”), this versatile systems can process up to 75 wafers simultaneously and are used for silicon and other wafers, like III/V-compound materials. Microwave plasma is inexpensive, user-friendly and highly reactive, operates efficiently and without damaging the electronic devices. The systems feature clean quartz chambers or optional ceramic chambers with Chemraz O-Rings, if fluorinated gases are used at higher concentrations. Optical end point detection and temperature indication are included. PS 300 The PS 300 is equipped with a hinged door for chamber loading access. The system is controlled by a microprocessor controller. PS 300 SA The PS 300 SA is equipped with a manual drawer loading door for chamber loading access. This eases the loading of the wafer boats and helps to reduce the particle level dramatically. The wafer boats are placed on cantilever support arms when door is opened without touching the plasma chamber walls. This eliminates the need for the operator to place the wafer boats inside of the chamber. The system is controlled by a microprocessor. PS 300 AL The PS 300 AL is optimised for high volume production. It features motor-driven drawer movement, prepared for a combination with an automatic wafer transfer unit for cassette loading. 2 cassettes with 25 wafers each can be loaded simultaneously (up to 6"), resulting in a throughput of more than 100 wafers/hour for regular post implant strip. The system is controlled by a PC via a color TFT screen. Options include SECS II host communication. The PS 300 AL is SEMI S2/S8 certified. |
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